ultra small highly semiconductor pressure sensor ps pressure sensor ps (adp4) features ?ultra-miniature size: much more compact than the pf pressure sen- sors offered in the past ?base area: 7.2(w) x 7.2(d) mm .283(w) x .283(d) inch ?only 60% in mounting area and 91% in over- all height of previous models (pf) ?high-level precision and linearity a high degree of precision and linear detector response have been achieved by applying the semiconductor strain gauge system. highly reproducible based on repeated pressure. ?impressive line-up of models ?taking their place alongside the standard 5k ? bridge resistance models are those with a 3.3k ? resistance which is optimally suited to 5v drive circuits. ?economy model (no glass base) gives out- standing value for consumer appliances 40 kpa (0.4 kgf/cm 2 ) and 49 kpa (0.5 kgf/cm 2 ) units are also available. example of pressure characteristics (when the rated pressure is between 98.1 kpa {1.0 kgf/cm 2 }) drive current: 1.5 ma rated current; ambient temperature: 25? 77? 0 {0} 0 50 100 49 {0.5} 98.1 {1} output voltage, mv pressure (gauge pressure), (kpa {kgf/cm 2 }) typical applications ?medical equipment: electronic hemody- namometer ?home appliance: vacuum cleaner ?gas equipment: microprocessor gas meter, gas leakage detector ?industrial equipment: absorption device, etc. silicon piezo resistance strain gauge anode junction glass base pressure pressure high reliability die bonding technology very strong, heat resistant body highly reliable wire bonding technology 4 bridge resistance 5.0k ? 3.3k ? packing quantity dip terminal: direction opposite the pressure inlet direction terminal pressure dip terminal: pressure inlet direction dip terminal: direction opposite the pressure inlet direction dip terminal: pressure inlet direction inner outer approx. 0.05kgf/cm 2 approx. 0.15kgf/cm 2 approx. 0.35kgf/cm 2 approx. 0.5kgf/cm 2 approx. 1.0kgf/cm 2 approx. 2.0kgf/cm 2 approx. 3.5kgf/cm 2 approx. 5.0kgf/cm 2 approx. 8.5kgf/cm 2 approx. 10.0kgf/cm 2 approx. 0.4kgf/cm 2 approx. 0.5kgf/cm 2 standard type (with glass base) economy type (without glass base) adp41010 adp41110 adp41210 adp41310 adp41410 adp41510 adp41610 adp41710 adp41810 adp41910 adp41320 adp42010 adp42110 adp42210 adp42310 adp42410 adp42510 ADP42610 adp42710 adp42810 adp42910 adp42320 adp41413 adp41913 adp41a23 adp42413 adp42913 adp42a23 100 pcs. 1,000 pcs. 4.9kpa 14.7kpa 34.3kpa 49.0kpa 98.1kpa 196.1kpa 343.2kpa 490.3kpa 833.6kpa 980.7kpa 40.0kpa 49.0kpa adp4: ps pressure sensor terminal profile and direction 1: dip terminal: direction opposite the pressure inlet direction 2: dip terminal: pressure inlet direction rated pressure 0: 4.9 kpa {approx. 0.05 kgf/cm 2 } 1: 14.7 kpa {approx. 0.15 kgf/cm 2 } 2: 34.3 kpa {approx. 0.35 kgf/cm 2 } 3: 49.0 kpa {approx. 0.5 kgf/cm 2 } 4: 98.1 kpa {approx. 1.0 kgf/cm 2 } 5: 196.1 kpa {approx. 2.0 kgf/cm 2 } 6: 343.2 kpa {approx. 3.5 kgf/cm 2 } 7: 490.3 kpa {approx. 5.0 kgf/cm 2 } 8: 833.6 kpa {approx. 8.5 kgf/cm 2 } 9: 980.7 kpa {approx. 10.0 kgf/cm 2 } a: 40.0 kpa {approx. 0.4 kgf/cm 2 } type 1 : standard type (with glass base) 2: economy type (without glass base) ordering information ex. adp bridge resistance 0 : 5.0k ? 3 : 3.3k ? part no. ultra-small miniature 7.2 .283 7.2 .283 8.6 .339 10.0 .394 existing products ps ?improved ease of dip pin insertion into printed circuit boards the ends of the dip pins are chamfered to ensure easy insertion into printed circuit boards. ps pressure sensor 04.11.10 11:31 am page 34
ps (adp4) data 1. characteristics data 1-<1> output characteristics adp41913 drive current: 1.0 ma; temperature: 30 c 86 f 1-<2> offset voltage temperature characteristics adp41913 drive current: 1.0 ma; rating 3.5%fs 1-<3> sensitivity temperature characteristics (%fs) adp41913 drive current: 1.0 ma; rating 2.5%fs 60 40 50 20 30 10 0 980.7/2 {5} 0 980.7 {10} kpa {kgf/cm 2 } output voltage (mv) rated pressure 4 3 2 1 0 2 1 30 +86 0 +32 60 +140 temperature ( c f ) offset voltage temperature characteristics (%fs) 4 3 2 1 0 2 1 sensitivity temperature characteristics (%fs) 30 +86 0 +32 60 +140 temperature ( c f ) 2. pressure cycle range (0 to rated pressure) tested sample: adp41913, temperature: 100 c 212 f , no. of cycle: 1 10 6 3 2 0 0 1 1 3 2 5 10 5 1 10 6 pressure cycle (cycle) offset voltage range (%fs) 3 2 0 1 1 3 2 5 10 5 1 10 6 0 output span voltage range (%fs) pressure cycle (cycle) even after testing for 1 million times, the vari- ations in the offset voltage and output span voltage are minimal. 2-<1> offset voltage range 2-<2> output span voltage range specifications gauge pressure standard type (with glass base) economy type (without glass base) type of pressure type air (for other medium, please consult us.) pressure medium 4.9 rated pressure 0.05 14.7 0.15 34.3 0.35 49.0 0.5 98.1 1.0 196.1 2.0 343.2 3.5 490.3 5.0 833.6 8.5 98.1 1.0 980.7 10.0 1.5 times the rated pressure 1.5 times the rated pressure 980.7 10.0 40.0 0.4 twice the rated pressure 49.0 0.5 unit: kpa unit: kgf/cm 2 (approx.) twice the rated pressure twice the rated pressure max. applied pressure 20 to 100 c 4 to 212 f (no freezing or condensation) ambient temperature 40 to 120 c 40 to 248 f (no freezing or condensation) storage temperature 0 to 50 c 32 to 122 f 0 to 60 c 32 to 140 f 5 to 45 c 41 to 113 f 0 to 50 c 32 to 122 f 20 to +70 c 4 to +158 f 40 to +120 c 40 to +248 f 5 to +50 c +23 to +122 f 20 to +100 c 4 to +212 f temperature compensation range 1.5 ma dc 1.0 ma dc 1.5 ma dc drive current (constant current) 100 40 mv 65 25 mv 43.5 22.5 mv 85 45 mv 40 20 mv output span voltage 20 mv 15 mv 25 mv offset voltage 5000 1000 ? 3300 700 ? 3300 600 ? 5000 1000 ? bridge resistance 0.7%fs 0.6%fs 15%fs 10%fs 5.0%fs 3.5%fs 2.5%fs 10%fs 1.3%fs 8%fs 2.5%fs 0.5%fs 0.4%fs 0.3%fs 1.0%fs 0.2%fs 1.0%fs 0.5%fs 0.6%fs 0.3%fs 0.4%fs 0.7%fs linearity pressure hysteresis offset voltage-temperature characteristics (0 to 50 c 32 to 122 f ) sensitivity-temperature characteristics (0 to 50 c 32 to 122 f ) notes) 1. unless otherwise specified, measurements were taken with a drive current of 0.01 ma and humidity ranging from 25% t o 85%. 2. please consult us if a pressure medium other than air is to be used. 3. this is the regulation which applies within the compensation temperature range. 4. please consult us if the intended use involves a negative pressure. ps pressure sensor 2004.11.1 7:04 pm page 35
ps (adp4) dimensions 1. terminal direction: direction opposite the pressure inlet derection adp41 2. terminal direction: pressure inlet direction adp42 general tolerance: 0.3 .012 mm inch 3. terminal connection diagram + input ? input ? output + output r 2 r 1 r 4 r 3 terminal no. name 1 power supply ( + ) 2 output ( + ) 3 power supply ( ? ) 4 power supply ( ? ) 5 output ( ? ) 6 no connection note: leave terminal 6 unconnected. tolerance: 0.1 .004 tested item tested condition result environmental characteristics endurance characteristics storage at high temperature left in a 120 c 248 f constant temperature bath 1,000 hrs. passed temperature: time: high temperature/high humidity operation 40 c 104 f , 90% rh 10 6 , rated voltage applied passed temperature/humidity: operation times: dropping resistance 75 cm 29.528 inch 2 times passed dropping height: times: terminal strength 9.8 n {1 kgf}, 10 sec. 4.9 n {0.5 kgf}, left and right 90 1 time passed pulling strength: bending strength: mechanical characteristics vibration resistance 1.5 mm .059 inch 10 to 55 hz x, y, z 3 directions 2 hrs each passed double amplitude: vibration: applied vibration direction: times: storage at low temperature left in a 40 c 40 f constant temperature bath 1,000 hrs. passed temperature: time: humidity left at 40 c 104 f , 90% rh 1,000 hrs. passed temperature/humidity: time: temperature cycle 40 c to 120 c 40 f to 248 f 30 min. 100 passed temperature: 1 cycle: times of cycle: soldering resistance soldered in dip soldering bath 230 c 446 f 5 sec. passed temperature: time: temperature 260 c 500 f 10 sec. passed temperature: time: 3. evaluation test note: for details other than listed above, please consult us. 3 japan 12 654 r0.2 r.008 7.2 .283 7.2 .283 4 .157 5 .197 3.5 .138 4.6 .181 pressure inlet hole 1.1 dia. .043 dia. 2.5 dia. 0.1 0 .098 dia. .004 0 4 dia. .157 dia. 0.1 0.5 .004 .020 0.25 2.5 .010 .098 .010 .098 0.25 2.5 atmospheric pressure inlet hole 8.2max .323max 0.1 0.25 .00 4 .010 9.5 1.5 .374 .059 tolerance: 0.1 .004 4 5 6 2 1 japan 3 r0.2 r.008 8.2max .323max 4 dia. .157 dia. .059 .374 1.5 9.5 pressure inlet hole 1.1 dia. .043 dia. atmospheric pressure inlet hole 7.2 .283 3.7 .164 7.2 .283 .010 .098 0.25 2.5 .010 .098 0.25 2.5 0.1 0.5 .004 .020 4 .157 5 .197 3.5 .138 2.5 dia. 0.1 0 .098 dia. .004 0 0.1 0.25 .00 4 .010 recommended pc board pattern (bottom view) 7.5 .295 6-0.9 dia. 6-.035 dia. 2.5 2.5 .098 .098 recommended pc board pattern (bottom view) 5 dia. .197 dia. 6-0.9 dia. 6-.035 dia. 7.5 .295 2.5 2.5 .098 .098 ps pressure sensor 2004.11.1 7:04 pm page 36
ps (adp4) notes 1. mounting use lands on the printed-circuit boards to which the sensor can be securely fixed. 2. soldering 1) due to its small size, the thermal capacity of the pressure sensor dip type is low. therefore, take steps to minimize the effects of external heat. dip soldering bath: max. 260 c 500 f , 5 sec. soldering iron: 260 to 300 c 500 to 572 f (30w) within 5 sec. 2) use a non-corrosive resin type of flux. since the pressure sensor dip type is exposed to the atmosphere, do not allow flux to enter inside. 3. cleaning 1) since the pressure sensor chip is exposed to the atmosphere, do not allow cleaning fluid to enter inside. 2) avoid ultrasonic cleaning since this may cause breaks or disconnections in the wiring. 4. environment consult with us before using or storing the pressure sensor chip in a place exposed to corrosive gases (such as the gases given off by organic solvents, sul- fites, hydrogen sulfides, etc.) which will adversely affect the performance of the pressure sensor chip. 5. quality check under actual loading conditions 1) to assure reliability, check the sensor under actual loading conditions. avoid any situation that may adversely affect its performance. 2) as for test data, please contact us. 6. other handling precautions 1) that using the wrong pressure range or mounting method may result in acci- dents. 2) air can be used directly as a pressure medium. consult with us before using a corrosive gas (such as a gas given off by an organic solvent, sulfite or hydrogen sulfide) as the pressure medium. 3) the pressure sensor chip is posi- tioned inside the pressure inlet. never poke wires or other foreign matter through the pressure inlet since they may damage the chip or block the inlet. avoid use when the atmospheric pres- sure inlet is blocked. 4) leave pin no. 6 unconnected since the pressure sensor chip may be dam- aged if a voltage is applied to this pin. 5) use an operating pressure which is within the rated pressure range. using a pressure beyond this range may cause damage. 6) since this pressure sensor chip does not have a water-proof construction, con- sult with us if it is to be used in a location where it may be sprayed with water, etc. 7) avoid using the pressure sensor chip in an environment where condensation may form. furthermore, its output may fluctuate if any moisture adhering to it freezes. 8) the pressure sensor chip is construct- ed in such a way that its output will fluc- tuate when it is exposed to light. especially when pressure is to be applied by means of a transparent tube, take steps to prevent the pressure sen- sor chip from being exposed to light. 9) avoid using the pressure sensor chip where it will be susceptible to ultrasonic or other high-frequency vibration. 10) since static charge can damage the pressure sensor chip, bear in mind the following handling precautions. when storing the pressure sensor chips, use a conductive material to short the pins or wrap the entire chip in aluminum foil. plastic containers should not be used to store or transport the chips since they readily become charged. when using the pressure sensor chips, all the charged articles on the bench surface and the work personnel should be grounded so that any ambient static will be safely discharged. 11) due to the pressures involved, give due consideration to the securing of the pressure sensor dip type and to the securing and selection of the inlet tube. consult us if you have any queries. application circuit diagram (example) the pressure sensor is designed to con- vert a voltage by means of constant cur- rent drive and then, if necessary, it amplifies the voltage for use. the circuit shown below is a typical example of a circuit in which the pressure sensor is used. op amp op amp op amp constant current circuit unit pressure sensor amplifier circuit unit mounting method the general method for transmitting air pressures differs depending on whether the pressure is low or high. checkpoints for use <1> select a pressure inlet pipe which is sturdy enough to prevent pressure leaks. <2> fix the pressure inlet pipe securely so as to prevent pressure leaks. <3> do not block the pressure inlet pipe. methods of transmitting air pressures when the pressure is low when the pressure is high (4.9 to 98.1 kpa) (196.1 to 980.7 kpa) if a tube is used as the pressure inlet pipe, it may become disengaged. therefore, use a sturdy tube and secure it using o-rings. tube printed- circuit board printed- circuit board o-ring pressure inlet pipe ps pressure sensor 2004.11.1 7:04 pm page 37
|
